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Solder paste printing is the first step in SMT production, a lot of quality defects are related to the solder paste printing quality.Monitoring the thickness of solder paste and changing trend, but not one of the key means of improve quality to reduce the repair cost, and is to meet the ISO quality system requirement for process parameters monitoring records, the important measures to improve customer confidence in production quality.

SPI3D series solder paste thickness tester adopts laser non-contact measuring the thickness of the solder paste, 3 d shape and size and statistical analysis, adopts advanced automatic measurement method and the quality of components, high precision, fast speed, human factors and environmental impact is small, using a simple and flexible, suitable for SMT solder paste thickness monitoring.