GAM-70 solder paste thickness

Functional specifications

This product is a non-contact thickness measurement equipment, this is forFine PitchProcess capability, the growth of the ascension of printing technology and precision request of the quality management of equipment, and can provide all kinds ofSPCStatistical analysis of values, and improve process capability.

1-1 scope

— Tin copper foil printing surface.

— All kinds of thickness measurement values: statistical analysis.

1 to 2System function

— automatic/Momentum of the solder paste thickness measurement.

— Solder paste hand momentum test length, width, spacing.

— Automatic calculation of solder paste area, cross-sectional area and volume.

— Measurement value records to save, and print.

— Can grabCCDThe photograph image and stored image file.

— Automatic calculation process capability indexCp、Cpk、Cpm。

— Provide figure and thickness distributionX-Bar /R-BarControl chart.

— At the same time according to different production line measurement for record respectively.

— Can be in accordance with the basic thickness measurement, fast adjust focal length.

— Can call the sample regularly.

1-3 system specifications

— Visual range:4.55mm i.3.50mm — Magnification:x90

— Power supply: provide computer

— Appearance of size:350(L) i. 400(W) i. 290(H)mm

— The overall weight:30kg — Inspection method:Laser Vision

— Mesa size:350(W) i. 265(L)mm — Measure thickness:0.5mm ~ 0.007mm

— Accuracy:(+-)0.0035mm — Analysis of the system:GAM70(Chinese interface)